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The MFC's 1200 sq. ft. Class-10 and 200 sq. ft. Class-1000 cleanrooms are state-of-the-art micromachining and microfabrication facilities. The processes in the Class-10 cleanroom are organized within 7 modules: entrance, photolithography, wet chemical processing, dry etching, thin film deposition and oxidation, wafer bonding, and chemical storage. Specifications include:  
  • fusion,anodic, and thermocompression silicon and glass wafer bonding
  • 1.5micron CMOS fabrication technology
  • upto 6" wafer processes(resist coat/develop on up to 8"wafers)
  • photolithography
  • LPCVD and PECVD of silicon dioxide, silicon nitride, and polysilicon
  • p-and n-type diffusionand drive-in
  • dry/wetoxidation
  • DCmagnetron sputteringand e-beam evaporation
  • wet/dryetchingincluding RIE and DRIE
  • metrologyandinspection systems
  • precisecontrol of Fabtemperature and humidity
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Thephotolithography module in the Class-10 processarea is structurally isolated to absorb vibration. A Karl Suss MA-6exposure tool withbackside alignment, an MTI resist coat/vapor-prime/develop roboticswafer handlingsystem, a Nanometrics film thickness monitor and an inspectionmicroscope are allself-contained within the photolithography module. These systems areoptimized to meetmost of the standard industry requirements and specifications.

Wet chemical stations located inthe main module, handlepractically all wet cleans, strips, and etching including HF, BOE,100:1 HF, hot phosphoric etch, aluminum etch, RCA1 clean, RCA2 clean,P-clean, M-Pyrol strip. Semitool systems perform the spin/rinse/dryoperationswhen required.

A Varian 3125 DC S-gun metalsputterer with 3 targetshaving the capability to deposit most metals used in industry includingaluminum with various percents of silicon and copper as well as varioussilicides. Another metal film deposition system available is a 4-pocketrotating turret Temescal e-beam evaporator. 

Several Bruce diffusion furnaces(atmospheric andLPCVD) are used for oxidation, diffusion and drive, anneal, LTO,polysilicon, and siliconnitride.  Reactive plasma/ion etchers using gas chemistries inDrytech and Trion Technology Phantom and Mini-Lok etcherscan remove metal, dielectric, silicon/polysilicon, oxide, and nitridefilms.

Wafer bonding is accomplishedusing ElectronVisions' EV420 Bond Aligner and EV501 anodic bonder.  Additionalcapabilities include through-waferI.R. alignment image capture with 1 micron alignment accuracy, vacuumand overpressure anodic bonding, and thermalcompression bonding.

Otherprocess/metrology/inspection equipment thatare an integral part of the main module are scanning electronmicroscope,Leitz MPV film thickness monitor, Nanometrics Nanoline optical widthmeasurement, Rudolph ellipsometer, Dektak profilometer, and opticalmicroscopes. All systemshave been optimized to meet industry specifications for various MEMS,microelectronics and microfabrication processes.

A separate 200 square ft class1000 cleanroom housesa Plasma-Therm SLR series ICP Deep Reactive Ion Etching system for deepvertical etchingof silicon and an Airco/Temescal 4 pocket e-beam evaporator fordeposition of a wide varietyof metals, wire bonder, and Weeco inspection system.